Product Positioning: High-Efficiency Power Control Solution

Heketai SI2301 is a P-CHANNEL MOSFET in SOT-23 package, specifically designed for DC-DC converters and load switches. With an ultra-compact size of 2.8-3.0mm × 1.2-1.4mm, it is suitable for high-density PCB (Printed Circuit Board) layouts. Equipped with ultra-low on-resistance, fast switching characteristics and high-reliability design, it provides a high-efficiency power control solution for electronic devices.

This device balances performance and cost requirements, and can directly replace similar 150mΩ products. While maintaining the same reliability, it reduces on-resistance loss by 40%, making it particularly suitable for portable devices and industrial control modules that are sensitive to both space and energy efficiency.

Core Technical Advantages

1. Ultra-Low On-Resistance

• The 2.3A model has an on-resistance as low as 88mΩ, and the 3.0A model as low as 85mΩ – a 40% reduction compared to the industry average.
• Directly reduces energy loss during the conduction phase and lowers system heat generation.
• Adapts to low-power consumption scenarios, extends battery life, and reduces long-term operating costs.

2. Fast Switching Characteristics

• Turn-on delay (td(on)) ≤ 20ns, turn-off fall time (tf) ≤ 20ns – a 40% improvement in response speed compared to traditional devices.
• Reduces overlap loss during switching and improves high-frequency conversion efficiency.
• Supports millisecond-level load switching to optimize dynamic power management performance.

3. High-Reliability Design

• Junction temperature range: -55℃ ~ 150℃, adapting to extreme ambient temperature fluctuations.
• UL 94V-0 flame-retardant package and 125℃/W low thermal resistance design ensure heat dissipation safety.
• Solderable terminals compliant with MIL standards, reducing the risk of soldering failures and improving production yield.

Model Parameter Comparison

Product Positioning: High-Efficiency Power Control Solution

Heketai SI2301 is a P-CHANNEL MOSFET in SOT-23 package, specifically designed for DC-DC converters and load switches. With an ultra-compact size of 2.8-3.0mm × 1.2-1.4mm, it is suitable for high-density PCB (Printed Circuit Board) layouts. Equipped with ultra-low on-resistance, fast switching characteristics and high-reliability design, it provides a high-efficiency power control solution for electronic devices.

This device balances performance and cost requirements, and can directly replace similar 150mΩ products. While maintaining the same reliability, it reduces on-resistance loss by 40%, making it particularly suitable for portable devices and industrial control modules that are sensitive to both space and energy efficiency.

Core Technical Advantages

1. Ultra-Low On-Resistance

• The 2.3A model has an on-resistance as low as 88mΩ, and the 3.0A model as low as 85mΩ – a 40% reduction compared to the industry average.
• Directly reduces energy loss during the conduction phase and lowers system heat generation.
• Adapts to low-power consumption scenarios, extends battery life, and reduces long-term operating costs.

2. Fast Switching Characteristics

• Turn-on delay (td(on)) ≤ 20ns, turn-off fall time (tf) ≤ 20ns – a 40% improvement in response speed compared to traditional devices.
• Reduces overlap loss during switching and improves high-frequency conversion efficiency.
• Supports millisecond-level load switching to optimize dynamic power management performance.

3. High-Reliability Design

• Junction temperature range: -55℃ ~ 150℃, adapting to extreme ambient temperature fluctuations.
• UL 94V-0 flame-retardant package and 125℃/W low thermal resistance design ensure heat dissipation safety.
• Solderable terminals compliant with MIL standards, reducing the risk of soldering failures and improving production yield.

Model Parameter Comparison

Typical Application Scenarios

1. DC-DC Converters

• The low on-resistance feature increases the energy efficiency of 5V-to-3.3V circuits by 5%-8%.
• Suitable for low-power consumption power management modules in smart wearable devices.
• Reduces heat accumulation during the conversion process and extends the service life of devices.

2. Load Switches

• 20ns-level fast switching supports dynamic power path switching in smartphones.
• Millisecond-level response speed optimizes the sleep-wake mechanism of IoT sensors.
• Low-power consumption feature extends the battery life of portable devices such as Bluetooth headsets.

Selection Recommendations

2.3A Model

• Recommended for load switches in consumer electronics (for current scenarios of 1-2.5A).
• Balances cost and performance, avoiding 15%-20% cost waste caused by over-design.
• Typical applications: Charging modules for smart watches, power management for TWS earphones.

3.0A Model

• Suitable for industrial-grade DC-DC converters (for continuous current above 2.5A).
• Low on-resistance reduces long-term operation losses and improves system stability.
• Typical applications: Industrial control modules, power supplies for smart home motor drives.

Take Action Now

Contact us to get:

• FAE (Field Application Engineer) technical support to solve design problems;
• Download the specification sheet from the official website to obtain complete electrical parameters and application circuit design guidelines;
• Apply for free samples with fast delivery;
• More favorable prices for bulk procurement to reduce mass production costs.

Company Introduction

Founded in 1992, Heketai is a high-tech and "Specialized, Refined, Characteristic, and Innovative" enterprise integrating R&D, design, production, and sales of professional electronic components. It focuses on providing cost-effective component supply and customization services to meet the R&D needs of enterprises.

Product Supply Range

It covers:

• Semiconductor packaging materials;
• Passive components such as resistors, capacitors, and inductors;
• Active components and power devices including MOSFETs, TVS diodes, Schottky diodes, Zener diodes, fast recovery diodes, bridge rectifiers, diodes, and transistors;
• Power management ICs and other related products.
• It provides a one-stop solution for all components required in R&D and production.

Two Intelligent Manufacturing Centers

• South China Manufacturing Center (Huizhou): Covers an area of 75,000 m²;
• Southwest Manufacturing Center (Nanchong): Covers an area of 35,000 m².
• Together, the two centers are equipped with over 3,000 sets of advanced production equipment and testing instruments. In 2024, 3 new semiconductor material subsidiaries were established to control production capacity and delivery efficiency from the source.

Packaging and Testing OEM Services

It supports sample customization and small-batch trial production. With over 100 patented technologies and certification systems including ISO9001 and IATF16949, the concept of "quality first" is implemented in every link from R&D to delivery.

Adhering to the core values of "Customer-Centric, Innovation-Driven", Heketai is committed to providing stable and reliable components for enterprises.

(Note: For sample application, solution consultation, or small-batch procurement ↓)

Contact Heketai via QR Code Scan

Scan the QR code to get in touch with Heketai.

• Sales Hotline: 18823438533 (WeChat ID is the same as this phone number)
• Company Tel: 0755-82565333
• E-mail: hkt@heketai.com
• Marketing Center: 8th Floor, Building 7, Kangli City, Longgang District, Shenzhen City, Guangdong Province
• Manufacturing Centers:

1. 183B, Puxinhu Commercial Street, Tangxia Town, Dongguan City
2. Buildings 17 & 18, Kechuang Center, High-Tech Zone, Nanchong City, Sichuan Province