Welcome to the official website of Shenzhen Heketai Electronics Co., Ltd.

Customer Service Hotline: 400-688-3313

Quality system management: Passed ISO9001, ISO14001 certification

We have the advanced international level of production line for packaging and testing semiconductor device

Engaged in the packaging and testing services of semiconductor discrete devices and integrated circuits

Manufacturing Equipment

Hottech has 328 advanced fully automated production equipments which imported from abroad to improve production efficiency,
reduce manufacturing costs and enhance brand competitiveness.Excellent semiconductors
are manufactured through standardized production processes.

Die Bond Workshop

The quantity of die Bonding :

  • ● ASMLotus-E*5
  • ● ASM838*5
  • ● ASM830*30
  • ● LDAB*10
  • ● ASMLotus-R*20
  • ● XZD SMA/SMAFL*6
  • ● ASM830Plus*5
  • Die Bond Workshop

  • Wire Bond Workshop

  • Molding Workshop

  • Forming workshop

  • Testing Workshop

Manufacturing Process

manufacturing process of die bonding, wire bonding, injection molding, forming, testing and packaging

Package way

Hottech,certified as a national high-tech enterprise ,is a domestic professional enterprise in design,
manufacturing and sale of semiconductor with 26 years of industry experience.
  • encapsulation:TSSOP8
    capacity:5000KK

    TSSOP8

  • encapsulation:TO-252
    capacity:5000KK

    TO-252

  • encapsulation:TO-251
    capacity:5000KK

    TO-251

  • encapsulation:SOT-323
    capacity:5000KK

    SOT-323

  • encapsulation:SOT89
    capacity:5000KK

    SOT89

  • encapsulation:SOT23-6
    capacity:5000KK

    SOT23-6

  • encapsulation:SOT23-5
    capacity:5000KK

    SOT23-5

  • encapsulation:SOT23-3L
    capacity:5000KK

    SOT23-3L

  • encapsulation:SOT23
    capacity:5000KK

    SOT23

  • encapsulation:SOP8
    capacity:5000KK

    SOP8

  • encapsulation:SOP7
    capacity:5000KK

    SOP7

  • encapsulation:SOD523
    capacity:5000KK

    SOD523

  • encapsulation:SOD123FL
    capacity:5000KK

    SOD123FL

  • encapsulation:SOD323
    capacity:5000KK

    SOD323

  • encapsulation:SOD123
    capacity:5000KK

    SOD123

  • encapsulation:SMBF
    capacity:5000KK

    SMBF

  • encapsulation:SMB
    capacity:5000KK

    SMB

  • encapsulation:SMAF
    capacity:5000KK

    SMAF

  • encapsulation:SMA
    capacity:5000KK

    SMA

  • encapsulation:PDFN5×6
    capacity:5000KK

    PDFN5×6

  • encapsulation:PDFN3×3
    capacity:5000KK

    PDFN3×3

  • encapsulation:MBS
    capacity:5000KK

    MBS

  • encapsulation:MBF
    capacity:5000KK

    MBF

  • encapsulation:ESOP8
    capacity:5000KK

    ESOP8

  • encapsulation:DBS
    capacity:5000KK

    DBS

  • encapsulation:ABS
    capacity:5000KK

    ABS