encapsulation：TSSOP8
capacity：5000KK
Quality system management: Passed ISO9001, ISO14001 certification
We have the advanced international level of production line for packaging and testing semiconductor device
Engaged in the packaging and testing services of semiconductor discrete devices and integrated circuits
Manufacturing Equipment
Hottech has 328 advanced fully automated production equipments which imported from abroad to improve production efficiency,
reduce manufacturing costs and enhance brand competitiveness.Excellent semiconductors
are manufactured through standardized production processes.
reduce manufacturing costs and enhance brand competitiveness.Excellent semiconductors
are manufactured through standardized production processes.
Die Bond Workshop
The quantity of die Bonding ：
- ● ASMLotus-E*5
- ● ASM838*5
- ● ASM830*30
- ● LDAB*10
- ● ASMLotus-R*20
- ● XZD SMA/SMAFL*6
- ● ASM830Plus*5
-
Die Bond Workshop
Wire Bond Workshop
Molding Workshop
Forming workshop
Testing Workshop
Manufacturing Process
manufacturing process of die bonding, wire bonding, injection molding, forming, testing and packaging
Package way
Hottech,certified as a national high-tech enterprise ,is a domestic professional enterprise in design,
manufacturing and sale of semiconductor with 26 years of industry experience.
manufacturing and sale of semiconductor with 26 years of industry experience.
TSSOP8
- encapsulation：TO-252
capacity：5000KK
TO-252
- encapsulation：TO-251
capacity：5000KK
TO-251
- encapsulation：SOT-323
capacity：5000KK
SOT-323
- encapsulation：SOT89
capacity：5000KK
SOT89
- encapsulation：SOT23-6
capacity：5000KK
SOT23-6
- encapsulation：SOT23-5
capacity：5000KK
SOT23-5
- encapsulation：SOT23-3L
capacity：5000KK
SOT23-3L
- encapsulation：SOT23
capacity：5000KK
SOT23
- encapsulation：SOP8
capacity：5000KK
SOP8
- encapsulation：SOP7
capacity：5000KK
SOP7
- encapsulation：SOD523
capacity：5000KK
SOD523
- encapsulation：SOD123FL
capacity：5000KK
SOD123FL
- encapsulation：SOD323
capacity：5000KK
SOD323
- encapsulation：SOD123
capacity：5000KK
SOD123
- encapsulation：SMBF
capacity：5000KK
SMBF
- encapsulation：SMB
capacity：5000KK
SMB
- encapsulation：SMAF
capacity：5000KK
SMAF
- encapsulation：SMA
capacity：5000KK
SMA
- encapsulation：PDFN5×6
capacity：5000KK
PDFN5×6
- encapsulation：PDFN3×3
capacity：5000KK
PDFN3×3
- encapsulation：MBS
capacity：5000KK
MBS
- encapsulation：MBF
capacity：5000KK
MBF
- encapsulation：ESOP8
capacity：5000KK
ESOP8
- encapsulation：DBS
capacity：5000KK
DBS
- encapsulation：ABS
capacity：5000KK
ABS