2026-02-09 16:29:37
How Does the Centralized Automotive Electronics Architecture (CEA) Reshape Component Requirements?
The evolution of automotive electronic architectures toward centralization has reshaped the logic of component selection: shifting from matching components for individual functions to adopting integra
2026-02-02 09:33:43
Technical Advantages of Automotive-Grade Alloy Resistors and Design Guidelines for Automotive Current Sampling
In key systems such as the Battery Management System (BMS) and motor drives of new energy vehicles, the precision and long-term reliability of current sampling directly affect battery safety managemen
2026-01-12 11:16:56
What Are the Fault Causes of TL431 in 12V 2A Switching Power Supplies? An In-depth Analysis by Hottech
In the design of 12V 2A switching power supplies, the TL431 acts as a key precision voltage reference, and its stability directly determines the output accuracy and reliability of the power supply.
2025-12-22 11:35:31
Why Is Fast Turn-Off Emphasized in MOSFET Driver Circuits? An In-Depth Analysis of the Underlying Technical Logic
And combined with Hekotai's technical optimization practices for MOSFETs, it reveals the necessity and implementation path of fast turn-off.
2025-12-15 10:29:03
How to Seize the Opportunity of Domestic Replacement for Electronic Components? A Practical Guide for Manufacturers After Nexperia's Crisis
With over 30 years of deep expertise in the electronic components industry, Hekotai has steadfastly advanced toward the goal of domestic replacement.
2025-12-01 14:07:16
Design Pain Points of High-Frequency MOSFETs: Principle and Solutions of the Miller Plateau
The Miller Plateau is a common challenge in the application of high-frequency MOSFETs. However, it can be effectively mitigated by understanding its principle, selecting devices with low gate-drain
2025-11-24 13:27:44
Hotrtech TOLL4-Packaged Super-Junction MOSFETs: A System Solution for Power Density Breakthrough
Heketai's TOLL4-packaged super-junction MOSFET (Model: HKTS13N65), relying on the synergistic optimization of super-junction technology and TOLL4 packaging, has become a core choice for improving powe
2025-11-17 17:38:08
Automotive-grade vs. Industrial-grade Components: In-depth Analysis of Core Differences and Selection Logic
Today, starting from the technical fundamentals and application scenarios, we will thoroughly explain the core differences between the two in a popular science style, helping you clarify the underlyin
2025-11-03 10:15:35
Principles of PCB Design for EMC Improvement: The Underlying Logic from Layer Layout to Component Selection
Electromagnetic Compatibility (EMC) is a core requirement for the stable operation of electronic equipment, covering two bidirectional issues: electromagnetic radiation and electromagnetic susceptibil
2025-11-03 10:01:57
What Makes the Bar for Automotive-Grade MOSFETs So High? A Comprehensive Guide to Their Rigorous Production and Certification Requirements
Automotive-grade certification is a high peak that can only be scaled with substantial investment and long-term technological accumulation. Heketai clearly recognizes this gap, and we are continuously
2025-07-28 17:54:59
Analysis of Heating Causes of Power MOSFETs in Power Management Scenarios
During operation, power MOSFETs inevitably generate heat, leading to a rise in temperature.
2025-05-09 09:58:07
Application of NMOS in charging pile
The requirements of fast charging also put forward higher requirements for the performance of power semiconductors. From high-voltage power conversion to low-voltage safety control scenarios, NMOS has
- 1
- 2
- 3
- 4
- 5