HKTQ50N03: The MOSFET That Doesn’t Need a Heat Sink? The Secret Behind Low-Voltage and High-Current Performance
Introduction
In low-voltage, high-current design, engineers aim to cut costs and reduce size—so they want to omit the heat sink, yet fear overheating will damage the MOSFET. While large packages offer good heat dissipation, they end up occupying half of the PCB board. Caught in this dilemma, choosing a MOSFET seems like a lose-lose situation. Today, we’ll break down the HKTQ50N03, a MOSFET that can operate "bare" without a heat sink, solving this tricky dilemma!
Three Core Advantages of HKTQ50N03’s Heat-Sink-Free Design
- Ultra-Low Internal Resistance: The on-resistance of HKTQ50N03 is as low as 1.8mΩ (@10V), 15% lower than that of similar products in the industry. The heat generation of a MOSFET essentially stems from conduction loss in the circuit. At a current of 50A, the conduction loss (calculated by I²R) is 4.5W. The 1W reduction compared to competitors means a direct temperature drop of 10-15℃—proving that this MOSFET can operate stably without a heat sink.
- Ultra-Low Thermal Resistance: By optimizing the packaging process, HKTQ50N03 uses silver paste to bond the copper frame with the chip, reducing the thermal resistance to 45℃/W. Lower thermal resistance translates to faster heat dissipation; in many cases, heat fails to dissipate and junction temperature spikes precisely because of excessively high thermal resistance. A thermal resistance of 45℃/W means the temperature only rises by 45℃ per watt of power consumption!
- High Redundant Junction Temperature: The maximum junction temperature of HKTQ50N03 is 175℃, 25℃ higher than the industry standard of 150℃. In high-temperature environments (e.g., 60℃ in automotive or industrial equipment), the junction temperature can be controlled at 78℃—far below the MOSFET’s limit—ensuring more stable and long-lasting operation over time!
Experimental Verification: Withstanding 55A Without a Heat Sink
Through scenario testing of four parallel-connected MOSFETs (measuring power loss, calculating temperature rise, and testing safe junction temperature), we found that the device can withstand a short-term pulse current of 55A without a heat sink, provided two conditions are met:
- The copper pad area is larger than 10 cm²;
- 3 to 5 thermal vias connected to the inner-layer ground copper foil are drilled.
The test results are as follows:
- Total Power Loss: With current evenly distributed among the four MOSFETs, the power loss per MOSFET is only 0.405W;
- Temperature Rise Calculation: 0.405W × 45℃/W ≈ 18℃ (per MOSFET);
- Safe Junction Temperature: Ambient temperature (60℃) + Temperature rise (18℃) = 78℃ ≪ 175℃ (limit).
Conclusion
The "low-loss + high thermal conductivity" characteristics of the HKTQ50N03 perfectly match low-voltage, high-current scenarios. Heketai focuses on the R&D of low-voltage, high-current MOSFETs, using technology to solve engineers' "design pain points" and make every component selection more reassuring.
Company Introduction
Founded in 1992, Heketai is a professional high-tech and "Specialized, Refined, Characteristic, and Innovative" enterprise integrating R&D, design, production, and sales of electronic components. It focuses on providing cost-effective component supply and customization services to meet the R&D needs of enterprises.
Product Supply Range
The product range covers semiconductor packaging materials, passive components such as resistors/capacitors/inductors, as well as MOSFETs, TVS diodes, Schottky diodes, voltage regulators, fast recovery diodes, bridge rectifiers, diodes, triodes, power devices, power management ICs, and more—offering a one-stop solution for all components required in R&D and production.
Two Intelligent Manufacturing Centers
The manufacturing centers in South China and Southwest China (75,000 m² in Huizhou + 35,000 m² in Nanchong) are equipped with over 3,000 sets of advanced equipment and testing instruments. In 2024, 3 new semiconductor material subsidiaries were added to control production capacity and delivery efficiency from the source.
Packaging and Testing OEM Services
It provides packaging and testing OEM services, supporting sample customization and small-batch trial production. Combined with more than 100 patented technologies and certification systems including ISO9001 and IATF16949, it ensures that "quality first" runs through every link from R&D to delivery.
Heketai always takes "customer-oriented, innovation-driven" as its core and provides stable and reliable components for enterprises.
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