Amid the new "Four Modernizations" wave in the automotive industry—electrification, intelligence, connectivity, and sharing—MOSFETs, as core switches for power conversion and control, have seen explosive growth in demand. However, automotive electronics impose far higher requirements for reliability and safety than consumer electronics, meaning not all MOSFETs can meet these standards. Behind the term "automotive-grade" lies a full set of extremely rigorous standards for design, production, testing, and certification.

I. Rigorous Production Equipment and Environment: Cleanrooms and Automation

The production of automotive-grade chips first demands exceptional standards for both environment and equipment.

• Ultra-cleanrooms: Production must take place in Class 100 or higher-grade ultra-cleanrooms, where the number of dust particles larger than 0.5 microns per cubic foot of air does not exceed 100. This prevents micro-particle contamination during chip production, eliminating internal defects and ensuring long-term reliability.
• Fully automated, high-precision production lines: From wafer fabrication, photolithography, and etching to packaging and testing, the entire process is completed by automated equipment. This minimizes errors and contamination caused by human operations, as the precision and stability of the equipment directly determine the consistency of chip performance.

II. Extreme Parameter and Reliability Requirements: Beyond On-Resistance

Consumer-grade MOSFETs may focus primarily on on-resistance and price, but automotive-grade products require more comprehensive parameter compliance:

1. Operating Junction Temperature (Tj): Consumer-grade products typically require a maximum Tj of ≤150°C, while automotive-grade products demand a minimum Tj of ≥175°C (and even up to 175°C–200°C). This is because the ambient temperature in automotive engine compartments is extremely high, requiring chips to operate stably at high temperatures for extended periods.
2. Reliability Lifetime Testing (HTRB/H3TRB): Tests are conducted under harsh conditions (e.g., 150°C high temperature and rated voltage high reverse bias) for up to 1,000 hours. Parameter drift is monitored to ensure no failure occurs under long-term high-voltage stress.
3. Shock and Vibration Resistance: Chips must pass strict mechanical stress tests that simulate continuous vibration and accidental impact during vehicle operation. This ensures the internal structure remains intact and free from cracking or solder detachment due to physical vibration.
4. Failure Rate (FIT) Requirements: Automotive-grade standards mandate extremely low failure rates, typically measured in FIT (Failures in Time). The target is single-digit FIT or even 0 FIT, meaning the number of failures approaches zero over 1 billion hours of operation—making reliability several orders of magnitude higher than that of consumer-grade products.

III. Authoritative Certification Standard: AEC-Q101

Automotive-grade MOSFETs must obtain AEC-Q101 certification, a stress test standard for discrete semiconductor components developed by the Automotive Electronics Council (AEC) and globally recognized as the "threshold" for automotive-grade qualification. AEC-Q101 includes a series of "hell-level" test items; only after passing all tests can a product earn certification and be accepted by automakers and Tier 1 suppliers. Key tests include:

• High Temperature Reverse Bias (HTRB)
• High Temperature Gate Bias (H3TRB): Tests the reliability of the gate oxide layer to prevent gate failure.
• Temperature Cycling (TC): Thousands of cycles between -55°C and 150°C to test stress caused by mismatched thermal expansion coefficients of different materials.
• Pressure Cooker Test (PCT): Evaluates the package’s resistance to moisture.
• ESD Capability: Requires a Human Body Model (HBM) rating of ≥2kV (or higher).

IV. Heketai’s Accumulation: Laying a Solid Foundation for Automotive-Grade Advancement

While Heketai’s current MOSFET products are primarily used in industrial control and consumer electronics (and have not yet completed full AEC-Q101 certification), we have accumulated profound expertise in production equipment, process control, and product reliability—providing the foundational conditions to move toward automotive-grade quality:

• Advanced production and packaging capabilities: Heketai owns imported fully automated packaging and testing lines, as well as high-standard Class 1,000 cleanrooms. Our production lines cover a wide range of package types, from classic TO-252, TO-220, and TO-247 to next-generation SOP-8, PDFN3×3, and PDFN5×6. We also continuously monitor cutting-edge packaging technologies such as TOLL, providing comprehensive hardware and process support for producing high-consistency, low-defect products.
• Strict quality control system: We implement internal quality control processes that far exceed consumer-grade standards, including 100% room-temperature and high-temperature parameter testing for all products. Regular reliability sampling tests (e.g., HTRB, ESD) are also conducted to ensure the stability and durability of delivered products.
• High-reliability product design: Heketai’s MOSFETs have been widely applied and validated in fields with strict reliability requirements, such as industrial power supplies and communication base stations. Our diverse package options and rigorous quality control demonstrate our ability to produce high-reliability semiconductor products.

Conclusion

In summary, automotive-grade certification is a high peak that can only be scaled with substantial investment and long-term technological accumulation. Heketai clearly recognizes this gap but is continuously investing to optimize manufacturing processes and enhance product performance. Our existing production conditions, quality control philosophy, and pursuit of reliability serve as the solid foundation for our future entry into the automotive-grade sector. For industrial and high-end consumer applications that do not require mandatory automotive-grade certification but still prioritize quality and reliability, Heketai’s MOSFETs are undoubtedly a cost-effective and trustworthy choice.

Company Introduction

Founded in 1992, Heketai is a high-tech enterprise specializing in electronic components, integrating R&D, design, production, and sales. We focus on providing cost-effective component supply and customization services to meet enterprise R&D needs.

• Product Range: Covers semiconductor packaging materials, passive components (resistors/capacitors/inductors), and active components (MOSFETs, TVS diodes, Schottky diodes, Zener diodes, fast recovery diodes, bridge rectifiers, diodes, transistors, power devices, and power management ICs). We offer one-stop procurement for all R&D and production needs.
• Two Smart Manufacturing Centers: Our South China (Huizhou, 75,000㎡) and Southwest (Nanchong, 35,000㎡) manufacturing centers are equipped with over 3,000 advanced devices and testing instruments. In 2024, we added 3 new semiconductor material subsidiaries to control production capacity and delivery efficiency from the source.
• Packaging and Testing OEM Services: We support sample customization and small-batch trial production. With over 100 patents and certification systems (ISO9001, IATF16949), we ensure "quality first" runs through every stage from R&D to delivery.

Guided by the core values of "customer-centricity and innovation-driven," Heketai is committed to providing stable and reliable components for enterprises.

(Note: For sample requests, solution consulting, or small-batch procurement ↓)

Contact Heketai via QR Code Scan

• Sales Hotline: 18823438533 (WeChat ID: Same as the phone number)
• Company Tel: 0755-82565333
• Email: hkt@heketai.com
• Marketing Center: 8th Floor, Building 7, Kangli City, Longgang District, Shenzhen City, Guangdong Province
• Manufacturing Centers:

1. 183B, Puxinhu Commercial Street, Tangxia Town, Dongguan City
2. Buildings 17 & 18, Science and Innovation Center, High-Tech Zone, Nanchong City, Sichuan Province